Samsung’s Cooling Innovation Could Help Qualcomm Snapdragon Chips

Samsung’s latest Exynos 2600 chip uses a new cooling technology called Heat Pass Block (HPB). A fresh report now suggests that this same technology could come to Qualcomm’s next-gen flagship Snapdragon chips. As such, the Korean firm’s Galaxy S27 Ultra, which might use the Snapdragon processor, will benefit from the HPB solution.

Qualcomm may use Samsung’s HPB technology in its flagship chips

There is no doubt that Qualcomm’s latest Snapdragon 8 Elite Gen 5 offers solid performance, with high clock speeds and advanced features. However, when it comes to heat management, even the powerful chip could struggle. For example, REDMAGIC 11 Pro, which runs this chip, has reached temperatures of around 56°C in stress tests.

Currently, most smartphones depend on passive cooling solutions, such as vapor chambers, for heat control. However, as chipmakers push for faster speeds, especially to handle advanced AI tasks, heat management has become more difficult. Thanks to Samsung’s HPB technology, the situation could improve greatly. If you are not familiar, HPB is a copper-based thermal component. It functions as a built-in heat sink to dissipate heat from the chip.

According to tipster Fixed-Focus Digital, Qualcomm may adopt HPB in its next-gen flagship Snapdragon chips. In fact, we have already heard that Samsung plans to make its cooling solution available to external customers, including Qualcomm. Now, it seems that some of this year’s Qualcomm chips will be using the technology. There’s chatter that the American firm may introduce two models: Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Gen 6 Pro. However, it’s unclear whether both versions or only the Pro variant will include HPB.

Samsung’s upcoming Galaxy S26 and Galaxy S26+ will likely run the Exynos 2600 in select markets. As a result, owners of these devices will benefit from HPB cooling technology. Meanwhile, the Galaxy S26 Ultra could use the Snapdragon 8 Elite Gen 5 globally, so it misses out on the innovative cooling solution.