Samsung Walks Through Exynos 2600’s HPB Thermal Design in Video

Samsung has released an official video presenting its new thermal solution, Heat Path Block (HPB). This technology focuses on improving heat dissipation within the processor to deliver more sustained performance under heavy workloads. The company’s latest Exynos 2600 mobile chip has adopted HPB to boost thermal management.

Samsung’s HPB thermal solution addresses chip overheating

While the Exynos 2600 will see gains in performance and efficiency from the cutting-edge 2nm node, the most important improvement comes from a better cooling solution. As such, Samsung developed HPB to control heat and maintain performance during demanding tasks.

In its latest video on YouTube, Samsung shows how it placed HPB alongside the application processor (AP) die and DRAM within the chip package. The company says the Exynos 2600 introduces an innovative thermal solution that maintains miniaturization while improving thermal management, enabling higher performance. Moreover, it claims that HPB offers up to a 16% improvement in thermal resistance compared to its predecessor.

For the uninitiated, HPB is a copper-based thermal component that sits on top of the AP die. It works like a built-in heat sink, helping move heat away from the chip more quickly. Since copper has very high thermal conductivity, this solution can reduce heat buildup, thereby improving thermal efficiency. As such, the new design can lower chip temperatures by up to 30% compared to the predecessors.

While the new thermal design looks promising on paper, its real-world performance will only come to light when Samsung launches the Galaxy S26 series. Rumors have it that the Exynos 2600 will power the Galaxy S26 and Galaxy S26+ in select regions.

Meanwhile, the next-generation Exynos 2700 will also reportedly adopt HPB, but with a different placement. The company may use a side-by-side (SbS) layout to place the AP die and DRAM horizontally. It could then put HPB on top of both components, allowing them to cool simultaneously.