Samsung Plans to Use 2nm Process for Custom HBM Logic Die

Samsung is gearing up for major technology upgrades for its high-bandwidth memory (HBM). The company plans to apply its 2nm foundry process to the logic die in custom HBM products. This move could allow the firm to attract global customers while solidifying its position in the AI semiconductor market.

Samsung aims to advance its custom HBM offerings

In HBM, the logic die (also called the base die) is an important silicon layer at the bottom of the DRAM stack that acts as the brain. Samsung’s 6th-generation HBM, HBM4, already uses a cutting-edge 4nm logic process. This strategy helps the company improve performance and power efficiency, and gain an edge over other memory makers. The chip may enter mass production stage in February 2026.

It looks like Samsung now wants to use an even smaller process node for the logic die. According to ZDNET Korea, the company is designing logic dies for custom HBM using processes as small as 2nm. Custom HBM lets customers use specific functions on the logic die. As such, they can customize their own AI chips as per system requirements.

“Samsung Electronics is designing a custom logic die for HBM under the leadership of the custom SoC (system-on-chip) team newly established within the System LSI Business Division last year,” said a semiconductor industry insider. “We are building a portfolio ranging from 4nm to 2nm to respond to the needs of various customers.”

The 2nm process is the most advanced semiconductor manufacturing technology. Samsung has already gained experience with this node by beginning mass production of its Exynos 2600 chip in Q4 2025. The chip uses the SF2 (first-generation 2nm) process. This experience should help develop next-generation HBM logic dies.

Samsung aims to target key clients such as Nvidia, AMD, Broadcom, Amazon Web Services (AWS), and OpenAI with its custom HBM solution. Industry watchers expect companies to widely adopt custom HBM starting with HBM4E (7th-generation HBM). This chip may debut sometime next year.