Samsung Passes Broadcom’s HBM3E Prototype and Pre-Mass Production Tests

A few months ago, Samsung obtained strong results in Broadcom’s 8-layer HBM3E quality test. It has now reportedly passed the prototype qualification test and completed the pre-mass production evaluation. This means the Korean firm will soon enter Broadcom’s supply chain, a massive step toward gaining a foothold in the HBM market.
Samsung successfully completes Broadcom’s HBM3E quality tests
As demand for high-performance computing (HPC) and cutting-edge technologies such as AI and machine learning rapidly increases, the need for HBM chips is growing significantly. While Samsung is not yet able to cater to the HBM market at the scale of its rivals, such as SK hynix, recent progress with Broadcom, Nvidia, and confirmed supply to AMD suggests that it is slowly strengthening its position in this space.
According to a report from a Korean media outlet, FETV, Samsung’s 8-layer HBM3E has recently cleared Broadcom’s qualification test, marking a major progress in the competitive HBM supply chain. The report said multiple test equipment suppliers have confirmed that Samsung’s improved HBM chip design has successfully passed all pre-mass production evaluations.
This is a big achievement for the company, especially after getting multiple feedback regarding power efficiency and heat generation from global customers. Industry analysts expect Samsung to begin supplying its HBM products to Broadcom in the second half of the year. However, as SK hynix has already secured a large HBM order from Broadcom, it will be interesting to see whether Samsung will also be able to secure a large order.
Meanwhile, Samsung is waiting for the approval of its 12-layer HBM3E from Nvidia. It has cleared Nvidia’s single-chip certification process and entered the final stage of full product validation. However, some reports say the certification process has been delayed to Q4 2025. Industry watchers believe the chances of passing the quality test are high, as Nvidia recently said that Samsung’s improved HBM solution is usable.










