Samsung’s HBM4 Performs Well in Nvidia’s Key Tests

Samsung’s 6th-gen high-bandwidth memory chip, HBM4, will likely pass Nvidia’s quality tests without any hurdles. The company has reportedly achieved top scores in system-in-package (SiP) testing, showing strong performance in speed and power efficiency. This could pave the way for the Korean firm to begin supplying HBM4 to Nvidia in the first half of 2026.

Samsung’s HBM4 Nvidia approval now looks highly likely

During the HBM3E era, Samsung struggled a lot to gain a foothold in the HBM market. The primary reason was delays in quality certification from Nvidia. This allowed its arch-rival, SK hynix, to become Nvidia’s primary supplier and dominate this space.

However, the situation seems to be changing in the HBM4 era. According to a report from Pulse, Nvidia recently visited Samsung to review progress on SiP testing for HBM4. For the uninitiated, SiP is a packaging technology that combines a bunch of components into a single package. For the 6th-gen chip, these include GPUs, memory, interposers, and power management chips. This test confirms all components work together efficiently, paving the way for mass production.

The good news is that Samsung delivered the best performance among memory makers, with faster speeds and better power efficiency. This suggests that the Korean firm is on a solid track to pass Nvidia’s quality verification. The report also says Nvidia wants more HBM4 from Samsung (higher than the Korean company’s internal projections).

An industry source noted, “Unlike during HBM3E development, there is a broad sense within Samsung’s development teams that they are ahead in HBM4.” Samsung could sign a formal HBM4 supply agreement with Nvidia in the first quarter of 2026. The company is reportedly in price negotiations with Nvidia, aiming to charge the same cost as SK Hynix. If the two companies reach an agreement, full-scale deliveries could begin in the second quarter of 2026.