Nvidia CEO Writes to Samsung Chief, Wants 12-Layer HBM3E Memory [U]

UPDATE, October 10: Shortly after we published this article, the original Korean report was updated to remove the mention of Nvidia’s CEO sending a letter to the Samsung Chief regarding 12-layer HBM3E memory. Samsung reached out to inform us of this change, noting that the revised version no longer includes this specific claim. It’s unclear whether this means the two parties have yet to ink a deal. The original article, published on October 9, follows.

Samsung has achieved a major breakthrough in its HBM (High Bandwidth Memory) business. After multiple setbacks, the company has finally stepped into Nvidia’s HBM supply chain. The firm will supply its 12-layer HBM3E chips for the GPU maker’s latest AI accelerator, the GB300.

Samsung’s 12-layer HBM3E memory to feature in Nvidia’s GB300 AI accelerator

While the HBM market continues to grow, Samsung is still struggling to capture a large share. The company is way behind SK Hynix, which secured a 62% share in Q2 2025, followed by Micron with 21%. The main reason was that the firm continued to fail quality tests for the 12-layer HBM3E memory product, preventing it from securing deals with Nvidia.

Of course, Samsung is selling HBM chips to other big clients like AMD. However, missing out on the leading player in AI accelerators has prevented the company from expanding the business. Finally, the firm has overcome these challenges. According to a report from News1, Nvidia CEO Jensen Huang recently wrote a letter to Samsung Chairman Lee Jae-yong, saying he wants to use Samsung’s 12-layer HBM3E memory in the GB300 system.

At the GTC 2024 conference, CEO Hwang signed a “Jensen Approved” note on Samsung’s 12-layer HBM3E product. This sparked industry discussions that Samsung would supply its 5th-generation HBM chips to Nvidia. However, the company faced repeated quality issues, leading to the redesign of the chip. Now, the letter serves as official confirmation that Samsung has passed the tests.

However, the two companies are yet to finalize the supply quantity, price, and delivery schedule. Since the industry is shifting to 6th-generation HBM4, Samsung’s 12-layer HBM3E for the GB300 is not expected to be produced in large quantities. Meanwhile, Samsung is reportedly gearing up to supply its HBM4 chips to Nvidia in the second quarter of 2026. We will learn more about the company’s HBM business in the coming months.