There’s little chance we may see Samsung’s affordable flip-style foldable, the Galaxy Z Flip FE, alongside the Galaxy Z Flip 7 and Fold 7 during the summer Unpacked event, expected in early July 2025. However, rumors surrounding the phone keep surfacing on the web, but with a lot of confusion from the marketing name to the chipset. Now, a fresh rumor says it won’t feature the Exynos chipset, suggesting it may either use a MediaTek Dimensity processor or an older Snapdragon chipset.
New leaks suggest Galaxy Z Flip FE won’t use Exynos chipset
It’s almost confirmed that the Galaxy Z Flip 7 will feature Samsung’s 3nm Exynos 2500 chipset, while the Galaxy Z Fold 7 will use the Snapdragon 8 Elite. But when it comes to Galaxy Z Flip FE, rumors point to a bunch of Exynos chips, including Exynos 2500, 2400, 2500e (which doesn’t even exist yet), and 2400e. Refuting all those rumors, noted tipster @Jukanlosreve claims that the Galaxy Flip FE will not use an Exynos chipset.
While the tipster did not reveal the exact chipset, there are two main possibilities — Samsung could lean towards either MediaTek’s Dimensity family or an older Snapdragon solution. A few days ago, a report suggested that the upcoming Fan Edition Galaxy S phone, the Galaxy S25 FE, might ditch Exynos 2400e for the Dimensity 9400. So, it won’t be surprising if Samsung adopts a Dimensity chipset for its Fan Edition foldable as well.
Another report points out that the upcoming Galaxy Z Flip FE may have the same specifications as last year’s Galaxy Z Flip 6. If true, the upcoming affordable flip phone could pack Qualcomm’s 2023 flagship chip, the Snapdragon 8 Gen 3. That could be a really good move from Samsung to balance cost and performance.
Either way, the Korean firm’s focus for the Z Flip FE will remain on keeping the price point lower while offering the foldable experience that consumers expect from Samsung. As the launch of Samsung’s next-generation foldable duo is nearing, we can expect more details to emerge in the coming weeks.
