Samsung Signs MOU with AMD for HBM4 and DDR5

Samsung has expanded its collaboration with AMD on next-generation AI memory and computing technologies. The two companies have signed a Memorandum of Understanding (MOU) that mainly focuses on HBM4 and DDR5 memory. The deal could not only boost the Korean firm’s overall memory business but also help it gain a foothold in the HBM space.

Samsung and AMD expand AI chip partnership

Samsung held the signing ceremony at its chip manufacturing complex in Pyeongtaek, Korea. Dr. Lisa Su, Chair and CEO of AMD, and Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics, attended.

Under the MOU, Samsung will supply its HBM4 for AMD’s next-generation Instinct MI455X GPU. The Korean firm’s HBM4 uses its 6th-generation 10nm-class DRAM process as well as a 4nm logic base die. The chip achieves processing speeds of up to 13 Gbps and a maximum 3.3 TB/s bandwidth. As a result, the MI455X GPU will efficiently handle AI model training and inference, powering high-performance systems.

It is worth mentioning that Samsung’s HBM3E powers AMD’s AI accelerators MI350X and MI355X. In fact, the two companies have worked together for nearly 20 years across graphics, mobile, and computing technologies.

Furthermore, Samsung and AMD will work on high-performance DDR5 memory to achieve industry-leading performance. The chip will power systems built on the AMD Helios rack-scale architecture. AMD’s 6th-generation EPYC CPUs will also benefit from this high-performance memory solution.

Speaking of the foundry partnership, Samsung will make AMD’s next-generation chips. While the key details are currently under wraps, this is a big win for the Korean foundry. The division has been trying hard to secure chip manufacturing contracts with major clients for years.

“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration,” said Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics. “From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD’s evolving AI roadmap.”