Samsung to Increase DRAM Production for HBM4

It looks like Samsung is seeing massive demand for its 6th-generation high-bandwidth memory, HBM4. The company has reportedly planned to increase production of the core components of HBM4, the 1c DRAM chips. This could allow the firm to meet growing market demand while strengthening its position in this space.

The rising demand for HBM4 may have encouraged Samsung to increase its 1c DRAM volume

According to a report from Hankyung, Samsung plans to boost its DRAM production at the Pyeongtaek Plant 4 (P4) in Gyeonggi Province. The company will build a new production line to make between 100,000 and 120,000 1c DRAM wafers per month by Q1 2027. The firm stacks 12 DRAM chips to create an HBM4 product, making it an ideal memory solution for handling complex calculations.

As of now, Samsung can make around 660,000 DRAM wafers per month at its facilities. Thanks to the addition of the new production line, the company’s total DRAM output could increase by nearly 18% in just one year. As a result, the company will be able to fulfill the increasing HBM4 orders from AI chipmakers such as Nvidia and AMD.

Previously, Samsung suffered setbacks in efficiently producing 1c DRAM wafers. The chip went through a redesign after Vice Chairman Jeon Young-hyun became head of the Semiconductor Device Solutions (DS) Division in 2024. As such, the company succeeded in improving its technology in the first half of 2025.

Last year, Samsung also built a production line of 1c DRAM, capable of about 60,000 to 70,000 wafers per month. If the new plan pans out, the monthly output will be close to 200,000 wafers. Furthermore, the company’s 4nm process line at the Pyeongtaek S5 foundry is now running at full capacity. This line produces a base die for HBM4. Meanwhile, the firm is also preparing to supply HBM4 to its major customers like Nvidia and AMD sometime this month.