Samsung Unveils Next-Gen HBM4 Chip, Eyes Nvidia Supply Deals

Samsung has unveiled its 6th-generation high-bandwidth memory chip, HBM4. The company displayed this cutting-edge product at the 27th Semiconductor Exhibition (SEDEX 2025) in Seoul. This shows the firm is ready to meet the growing demand for high-speed memory in AI accelerators.

Samsung shows its cutting-edge HBM4 at SEDEX 2025

While Samsung failed to lead the HBM market with its HBM3E chip, the company remains confident that HBM4 will be a turning point for its recovery. At present, SK Hynix is the global leader in this space, followed by Micron (second) and Samsung (third). In the HBM4 era, Samsung needs to strengthen its technology while securing key clients to gain a foothold.

At SEDEX 2025, Samsung showcased (via The Asia Business Daily) the HBM4 12-Stack alongside its HBM3E 12-Stack products. The idea is to tell the world that the company is pioneering cutting-edge technologies in HBM. The HBM4 uses a 10-nanometer class and sixth-generation 1c process. The Korean firm has already sent samples of the HBM4 12-Stack to Nvidia for testing. Nvidia’s feedback will determine whether it will secure supply deals for its next-generation product.

It is worth mentioning that Samsung has adopted a different approach from its rival SK Hynix. The global leader uses a 10-nanometer-class and fifth-generation 1b process for its HBM4 chip. With the advanced 1c process, Samsung is taking a higher-risk path to obtain high performance. Whether Samsung’s strategy proves successful will become clear when Nvidia completes its evaluation of the HBM4 samples.

Meanwhile, Samsung’s HBM4 development seems to be on the right track. Its HBM4 4nm logic die has achieved a yield of over 90%, which is a very promising result. Built on an in-house 4nm process, the logic die sits at the bottom of the HBM4. Now, if the company achieves the recommended yield for its 1c DRAM, it may begin stable mass production of the next-generation memory chip, expected sometime in 2026.