Exynos 2600 Chip May Feature Advanced Heat Control Technology

One of the major concerns about Samsung’s Exynos chips is their tendency to generate excessive heat and experience thermal throttling. The company may finally address this issue by using advanced packaging technology in its upcoming Exynos 2600 2nm chip. The new technology contains heat-dissipating materials, which could lead to better thermal management and improved performance.

Samsung’s next-gen flagship mobile chip may pack a copper-based heatsink to absorb heat

A few days ago, Samsung confirmed that it is considering using the Exynos 2600 chip in its upcoming Galaxy S26 series. Built on its in-house 2nm process, the chip is expected to offer substantial improvements in performance and power efficiency compared to its predecessor. However, with the increased performance, overheating remains a concern. To address this, the Korean firm is reportedly adopting a new heat management technology.

According to a report from ZDNET Korea, Samsung may add a new cooling technology called Heat Pass Block (HPB) into its Exynos 2600 chip. This will be the first time the firm uses HPB inside the chip package. The current Exynos chip has a PoP (package-on-package) structure, where the DRAM sits on top of the application processor (AP).

Speaking of HPB, it’s a copper-based heatsink that absorbs heat coming from the processor. In the new design, Samsung will integrate the HPB on top of the AP together with the DRAM. As a result, the chip should experience reduced thermal buildup during heavy tasks.

Furthermore, Samsung is also using FOWLP (Fan-Out Wafer Level Packaging), an advanced packaging technology first introduced with the Exynos 2400. Instead of a PCB (printed circuit board), FOWLP puts the chip directly onto a silicon wafer. This results in a thicker silicon layer, which is beneficial for improving heat dissipation characteristics.

The publication says that Samsung plans to complete quality testing of the Exynos 2600 chip by October 2025. Hopefully, the Korean firm does not face any issues during testing and can begin mass production immediately. If successful, we may finally see the return of the Exynos flagship chip in the 2026 Galaxy S series, at least in some regions.